The Telecommunications Industry Association (TIA) has created a new telecommunications systems bulletin (TSB), "Adh...
July 21, 2003
The Telecommunications Industry Association (TIA) has created a new telecommunications systems bulletin (TSB), “Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges,” TSB-144.
This bulletin provides general information and guidance on adhesive bubbles and voids within fiber optic components and devices.
Previously undocumented but widely accepted subject knowledge is summarized within the document. Potential issues, solutions and challenges relevant to the telecommunications industry, military and aerospace sectors are discussed.
The document is applicable to fiber optic component reliability. It is written for fiber optic component manufacturers, as well as end-users and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability, under the cognizance of FO-6.3 Subcommittee on Interconnecting Devices and Passive Products.
TIA-604-2-A was created by TIA FO-4.3 Subcommittee on Interconnecting Devices and released April 2003. A TSB is not a standard, but rather contains technical material that may be valuable to industry and users. Copies of the document can be obtained at www.global.ihs.com.