Upwards of 10 Optical Internetworking Forum (OIF) members are uniting to showcase multi-vendor participation in OIF Interoperability 2012 -- Enabling High-Speed Dynamic Services. The OIF's Physical and Link Layer (PLL) demonstration will...
February 8, 2012
Upwards of 10 Optical Internetworking Forum (OIF) members are uniting to showcase multi-vendor participation in OIF Interoperability 2012 — Enabling High-Speed Dynamic Services. The OIF’s Physical and Link Layer (PLL) demonstration will showcase interoperability of the Forum’s Common Electrical Interface (CEI) 28G Very Short Reach (VSR) draft implementation agreement that defines chip-to-module electrical interfaces.
Demonstrations of the CEI-25G-LR signal for backplane interfaces will also be tested and on display at the OFC/NFOEC conference next month in Los Angeles.
“This demonstration of CEI-28G-VSR shows the ability to reach 100G for next-generation 4 x 25Gb/s based optical transceivers,” said Ed Frlan, chair the OIF PLL Interoperability Working Group. “The CEI-25G-LR and CEI-28G-VSR electrical interface and signaling schemes being tested for interoperability support multiple 100G applications.”
The following companies are participating: Altera, Amphenol, Fujitsu Optical Components, Gennum, IBM, Inphi, Luxtera, Molex, TE Connectivity and Xilinx.
Equipment used during the testing will include host IC with VSR SERDES, host PCB traces, optical module connectors, module retimers and optical transceivers. Test equipment used in the demonstration is supplied by Tektronix Inc.
Launched in 1998, the OIF is the first industry group to unite representatives from data and optical networking disciplines.