Multiservice edge equipment based on tightly integrated, next-gen Sonet/SDH silicon has radically improved carriers...
July 7, 2004
Multiservice edge equipment based on tightly integrated, next-gen Sonet/SDH silicon has radically improved carriers’ ability to offer packet services over legacy infrastructure.
Encouraged by this success, chip makers and equipment manufacturers are now extending their activities to smaller, less-expensive access products, according to the new Next-Gen Sonet/SDH Chip Survey from Light Reading Insider.
“The access market is very active,” says Simon Stanley, the report’s author. “Driven by the demand from system OEMs, vendors are introducing new devices at 155 Mbit/s, 622 Mbit/s, and 2.5 Gbit/s with support for low-order virtual concatenation.”
This focus on access, the research firm says, is a lead indicator of the buzz set to emerge around so-called micro MSPPs (multiservice provisioning platforms), being developed to help carriers extend their infrastructure closer to their customers and consolidate services into a single pipe.
The survey examines 31 next-gen Sonet/SDH silicon products from 10 major suppliers in the market including Intel Corp. and PMC-Sierra Inc.
Further information is available at www.lightreading.com.