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Election Day at TIA

TR-42 members cast their ballots at meeting in St. Louis.

November 1, 2003  

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In October, the TIA TR-42 meeting was held in St. Louis, Mo., the gateway to the U.S. West. The odd number sub-committee chairs and vice-chairs were up for election. Each of these mandates has a duration of two years. Results are as follows:

TR 42.1 Commercial Building Telecommunications Cabling: Herb V. Congdon II from Tyco Electronics elected chair and myself as vice-chair;

TR 42.3 Commercial Building Telecommunications Pathways and Spaces: Steve Huffaker from Bank One Corp. elected chair and Glenn Sexton from Northwest Information Services elected vice-chair;

TR 42.5 Telecommunications Infrastructure Terms and Symbols: Peter Sharp from Giffels Associated Ltd. elected chair and Steve Huffaker from Bank One Corp. elected vice-chair;

TR 42.7 Telecommunications Copper Cabling Systems: Paul Z. Vanderlaan from Belden Wire and Cable Company elected chair and Valerie Rybinski from Hitachi Cable Manchester Inc. elected vice-chair;

TR 42.9 Industrial Telecommunications Infrastructure: Shadi AbuGhazaleh from Hubbell Premise Wiring Company elected chair and Bob Lounsbury from ODVA/Rockwell Automation elected vice-chair;

The even number sub-committee chairs and vice-chairs as well as the TR-42 chair and vice-chair will be up for election at the next meeting to be held in February 2004.

Highlights of the meeting included:

Draft ANSI/TIA/EIA-568-B.1-5, Additional Cabling Guidelines for Telecommunications Enclosures being put out for its first industry ballot. This discusses the impact of the use of a telecommunications enclosure in the cabling infrastructure, and provides the appropriate structured cabling guidelines. We resolved all technical comments and it was approved to go out for default ballot;

Draft ANSI/TIA/EIA-568-B.1-6, Additional Cabling Guidelines for DC Power, which discusses cabling guidelines when DC power is inserted onto a structured cabling infrastructure to povide power to low voltage applications. We resolved all technical comments and it was approved to go out for a second industry ballot;

The Telecommunications Infrastructure Standard for Data Centers draft document out for its first industry ballot. This document discusses cabling needs for data centers such as facility design, cabling design and network design in a data center environment. We resolved all technical comments and it was approved to have draft 3.0 out for a second industry ballot sometime in November;

The revision of ANSI/TIA/EIA-570-A, Residential Telecommunications Cabling Standard, to develop a B version, started a few months ago. It was approved to send the draft ANSI/TIA/EIA-570-B out for final default ballot. If no technical comments are received, it has been

approved to have the document published. Some major changes: The introduction of Category 5e, Category 6 and optical fiber cabling systems, guidelines on cabling administration (with the exception of multi-dwelling units which are considered as commercial environments and should follow ANSI/TIA/EIA-606-A), and Coax testing, and;

The revision of ANSI/TIA/EIA-569-A, Commercial Building Standard For Telecommunications Pathways and Spaces, to develop a B version was started a couple of years ago. It was approved to send the draft ANSI/TIA/EIA-569-B out for final default ballot. This means that this document is going into its final stage and we should expect publication approval at the February 2004 meeting. Currently, the main contentious points are related to telecommunications enclosures space requirements;

I hope this update has shed some light on what has been happening recently with standards. The next meeting will be held in San Diego, Calif. in February. Until then, Happy Holidays everyone.

Julie Roy, RCDD/LAN specialist, is the IBDN Systems, Applications & Standards Manager at NORDX/CDT. She is also vice-chair of the TR-42.1 engineering subcommittee on commercial building telecommunications cabling.

Disclaimer: The information presented is the author’s view and is not official TIA correspondence.