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New standard zeroes in on telecom ground and bonding systems

The Telecommunications Industry Association (TIA) has published a new joint standard, "Commercial Building Gro...


November 19, 2002  


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The Telecommunications Industry Association (TIA) has published a new joint standard, "Commercial Building Grounding (Earthing) and Bonding Requirements for Telecommunications," J-STD-607-A.

The document was jointly developed by TIA and the Alliance for Telecommunications Industry Solutions (ATIS).

The purpose of this standard is to enable the planning, design and installation of telecommunications grounding and bonding systems with a building with or without prior knowledge of the telecommunications systems that will subsequently be installed.

It also provides recommendations for grounding and bonding of customer-owned towers and antennas.

This telecommunications grounding and bonding infrastructure supports a multivendor, multiproduct environment as well as various system installation practices.

The standard was produced by TIA/EIA Working Group 41.7.2, in coordination with ATIS T1E1.5 and T1E1.7. It’s been approved by TIA/EIA Technical Committees TR-41, ATIS Committee T1 and the American National Standards Institute.