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Molex introduces ModLink Plug & Play Copper offering

Molex has announced the release of its ModLink Plug and Play Copper product, a custom pre-terminated high density modular product. It utilizes the company's patented Molex iPass, a low profile slim li...


November 1, 2008  


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Molex has announced the release of its ModLink Plug and Play Copper product, a custom pre-terminated high density modular product. It utilizes the company’s patented Molex iPass, a low profile slim line I/O connector designed specifically for high density applications. The connector is made from die-cast zinc alloy and has a narrow latch-pull design that enables swift and positive connect or disconnect.

The ModLink also consists of Distribution Cables, used as the interconnection cable between cassettes (with an iPass to iPass assembly), and Hydra Cable assemblies (iPass to 6 RJ45 plugs) predominantly used for panel to panel or switch to panel links.

All Molex Premise Network systems are backed by a 25-year product, system performance and application assurance warranty when installed as a certified system by a Molex Certified Installer.

Molex

www.molex.com