Worldwide sales of copper-based carrier Ethernet access platforms rose 42% year-over-year to US$266 million in the rolling four-quarter period ending in the first quarter of this year, according to th...
September 1, 2009
Worldwide sales of copper-based carrier Ethernet access platforms rose 42% year-over-year to US$266 million in the rolling four-quarter period ending in the first quarter of this year, according to the new report published by Heavy Reading.
Copper-based CEAP platforms include Ethernet-over-bonded copper pair (G. shdsl and MIMO on DMT) and Ethernet-over-TDM access circuit solutions.
“Many service providers who collectively spent billions of dollars deploying carrier Ethernet/MPLS-based network infrastructure during 2006-2008 are now increasingly shifting their attention to adding low-cost copper-and fiber-based Ethernet endpoints said Stan Hubbard, Senior Analyst at Heavy Reading and author of the CEAP Quarterly Market Tracker.
“In 1Q09, global E-o-bonded copper pair platform sales grew slightly quarter-over-quarter, while E-o-TDM access circuit and E-o-fiber access platform revenues dipped only modestly on a sequential basis,” he said. “This stands in sharp contrast to the double-digit sequential revenue declines we saw for carrier Ethernet switches and routers that sit further back in the network.”
Heavy Reading estimates that the global market for combined E-o-bonded copper pair platform sales is likely to reach nearly US$500 million by 2013.
The firm said that industry feedback suggests that telecom operators are particularly attracted by the rapid return on investment offered by copper-based solutions that leverage the existing physical network infrastructure and help them better manage scarce capital resources during the economic recession.
The larger Ethernet-over-fiber demarcation/access switch market also is likely to record substantial growth over the next several years, as Ethernet business services and mobile backhaul bandwidth requirements increase, it added.