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Carrier Ethernet Access Platform market poised for solid growth

Worldwide sales of copper-based carrier Ethernet access platforms (CEAP) rose 42% year-over-year to US$266 mil...


July 15, 2009  


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Worldwide sales of copper-based carrier Ethernet access platforms (CEAP) rose 42% year-over-year to US$266 million in the rolling four-quarter period ending in the first quarter of this year, according to the new report published by Heavy Reading www.heavyreading.com.

 

Copper-based CEAP platforms include Ethernet-over-bonded copper pair (G.shdsl and MIMO on DMT) and Ethernet-over-TDM access circuit solutions.

 

“Many service providers who collectively spent billions of dollars deploying carrier Ethernet/MPLS-based network infrastructure during 2006-2008 are now increasingly shifting their attention to adding low-cost copper- and fiber-based Ethernet endpoints,” said Stan Hubbard, Senior Analyst at Heavy Reading and author of the CEAP Quarterly Market Tracker.

 

Heavy Reading estimates that the global market for combined E-o-bonded copper pair platform sales is likely to reach nearly US$500 million by 2013.

 

The firm said that industry feedback suggests that telecom operators are particularly attracted by the rapid return on investment offered by copper-based solutions that leverage the existing physical network infrastructure and help them better manage scarce capital resources during the economic recession.

 

The larger Ethernet-over-fiber demarcation/access switch market also is likely to record substantial growth over the next several years, as Ethernet business services and mobile backhaul bandwidth requirements increase.